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July 2, 2008

The Intel Core 2 Duo E-8400 CPU was designed specifically for mobile applications and features a clock speed of 3.00 Ghz.

It also sports a 65W TDP with a VID voltage range from 0.85V to 1.3625V. Aside from the 1.33 Ghz bus speed and 45nm manufacturing, some of the other shared features for this processor include Enhanced Intel SpeedStep Technology (EIST), EM64T, Intel Virtualization Technology (VT), Enhanced Halt State (C1E), Execute Disable Bit, and Intel Thermal Monitor 2.

More details on some of the other architectural advancements made with these latest Intel dual-core processors with technologies such as Advanced Smart Cache and Smart Memory Access are available on the Intel website.

While the design is pretty much the same, the heatsink shipping the E-8400 CPU is much slimmer than some of Intel's earlier LGA-775 reference heatsink designs.

This heatsink fan is quiet during operation and has a 4-pin connection for PWM (Pulse Width Modulation) support.

The slug of the heatsink that is exposed to the Intel processor has thermal paste pre-applied.

This portion of the heatsink is made of copper while the surrounding fins are aluminum.

Besides being designed specifically for MIDs (mobile Internet devices), Intel's new E8400 processor has proven itself very capable with the Linux operating system, with excellent overall reliability and performance.

Source: Tech News Blog.

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